Since 1986 Semefab has engaged with a wide variety of organizations, from fabless chip companies, OEM’s and start-ups to major semiconductor manufacturers, inducting and developing their semiconductor processing technologies.

Most customer relationships last for many years and as technology and equipment capabilities have advanced, Semefab has worked closely with its customer base to allow them to take advantage of next generation products and designs.

Over time we have developed extremely robust management practices and operational procedures which allow Semefab to efficiently run many concurrent processes from MEMS through to Integrated Circuits and Discrete Semiconductor devices across 3 wafer fabs, under tight discipline and at high yields. Each process is fully documented, subject to FMEA and statistical process control. Our highly experienced Process and Equipment Engineering Teams are able to investigate any deviations from control limits and are quickly able to rectify matters should any problem arise.

A quality control plan is agreed for each specific product/process according to discussion and agreement with the customer. Quality control procedures are implemented according to Semefab’s Quality Policy and ISO 9001 management procedures. Performance is reviewed monthly by the entire management team and our system is audited annually by the British Standards Inspectorate. Semefab issues a quality control certificate of conformance with every shipment of its product.

FAB 1
Semefab’s Fab1 is a 900 square metre class 100 operation (class 10 Photo) supporting 4″ volume foundry. CMOS (20V to 5V); Linear IC (40V/60V); Dielectrically Isolated BiCMOS (100V); small signal low noise JFET; RF MOSFET (12V/50V 1GHz); N & P Channel Lateral MOSFET (200V 8A); Photodiode; Fast Recovery Diode and MEMS (front end).

Minimum feature size capability 2.5µm.